Market Research Future Insights
According to market research future
insights analysis, the global semiconductor Bonding
market
is expected to register a CAGR of ~&.80% from 2022 to 2030 and hold a value
of over ~USD 1592.98 billion by 2030.
A significant portion of
the Internet of Things (IoT) field requires features similar to the stacked die
technology. The stacking die decreases the final design's overall size.
Handheld electronic devices are one of the main causes of the widespread adoption
of the stacked die method. As a result, the growing need for semiconductor
bonding solutions is to blame for the growing adoption of die technology in IoT
devices. Additionally, industry 4.0's arrival and the development of
cutting-edge technologies like artificial intelligence in the automobile
industry strongly promote new market developments. Developing technologies like
adaptive cruise control, enhanced driver assistance systems, and others will
support the growth of the worldwide semiconductor bonding market.
Key Players
Some of the key market
players are ASMPT, Panasonic
Corporation, Fasford Technology Co.,Ltd., SHINKAWA Electric Co., Ltd, SUSS
MicroTec SE, EV Group (EVG), Kulicke and Soffa Industries, Palomar
Technologies, Shibuara Mechatronics Corporation, TDK Corporation, Tokyo
Electron Limited, Mitsubishi Heavy Industries, Ltd., Mycronic Group, Intel
Corporation, Sky Water Technology, Tessera Technologies, Inc., Besemiconductor.
Regional Analysis
North America dominated
the market for semiconductor bonding in 20201. because memory chips are
increasingly needed in electronic components. There is an increasing need for
technological developments in the automobile sector, such as the development of
self-driving cars and advanced driver assistance systems (ADAS).
Asia Pacific region is
expected to register tremendous growth in the market for semiconductor bonding.
Additionally, industry 4.0's arrival and the development of cutting-edge
technologies like artificial intelligence in the automobile industry strongly promote
new market developments.
Market Segmentation
The global
semiconductor-bonding market has been segmented into type, process type,
bonding technology, and application.
Based on type, the
semiconductor bonding market is divided into die bonders, wafer bonders and
flip chip bonders. The wafer bonder segment accounted for the largest share of
the semiconductor bonding market in 2021. Wafer bonding is increasingly used in
silicon-on-insulator (SOI) devices, silicon-based sensors, actuators, and
optical devices. Wafer bonding technology offers several benefits, including
preventing surface bubbles and various bond substances and using a thinning
method for the smart cut procedure.
The market has been
segmented based on process type into die-to-die bonding, die-to-wafer bonding
and wafer-to-wafer bonding. Die to water segment accounted for a huge revenue
share in 2021. Die-to-wafer bonding is a permitted approach to accelerate the implementation
of 3D/heterogeneous integration and produce new generations of equipment with
excessive bandwidth, performance, and coffee energy consumption.
Based on bonding
technology, the semiconductor bonding market has been bifurcated into die
bonding technology, eutectic die bonding, epoxy die bonding, epoxy die bonding,
flip chip attachment, hybrid bonding (for 3D NAND), wafer bonding technology,
direct wafer bonding, anodic wafer bonding, and others. Die bonding technology
segment accounted for the healthiest revenue share in 2021 in the market for
semiconductor bonding. Die bonding is a production technique applied to the
wrapping of semiconductors. It is also known as "die to attach" or
"die placement," and it entails attaching a die (or chip) to a
substance or packaging using glue or a sinter.
Based on application, the market is divided
into RF devices, Mems And sensors, cmos image sensors, LED and 3D NAND. LED
segment accounted for the largest revenue share in 2021 in the market for
semiconductor bonding. When an electric current flows through a Light Emitting
Diode (LED), also known as an LED, it emits light. This is accomplished by
reassembling p-type semiconductor gaps with n-type electron density to generate
light. The absorption edge of the semiconductor object determines the light's
wavelength.
Read
More @
Lithium-Ion Battery Market Set to
Reach USD 118.15 Billion at a CAGR of 4.72% by 2030- Report by Market Research
Future (MRFR)
Application-Specific
Integrated Circuit Market Valued at USD 37.5737 at a CAGR of 9.00% by
2030- Report by Market Research Future (MRFR)
Smart Home Device Market is
Projected to reach USD 302.02 Billion at a CAGR of 10.45% by 2030- Report by
Market Research Future (MRFR)
Smoke Alarm Market to Hit
USD 06 Billion at a CAGR of 8.00% by 2030- Report by Market Research Future
(MRFR)
Contact us:
Market Research Future®,
99 Hudson Street,
5Th Floor,
New York, New York 10013,
United States of America
Phone: +1 628 258 0071(US),+44 2035 002 764(UK)
Email: sales@marketresearchfuture.com
No comments:
Post a Comment